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CHIP BEAD INDUCTORS FOR POWER LINE （FB SERIES M TYPE）
■ PRECAUTIONS
1. Circuit Design
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment, (office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
Precautions
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
◆Rated current
1. Rated current of this product is shown in this catalogue, but please be sure to have the base board designed with adequate inspection in
case of the generation of heat becomes high within the rated current range when the base board is in high resistance or in bad heating
conditions.
2. PCB Design
Precautions
◆Land pattern design
1. Please refer to a recommended land pattern.
3. Considerations for automatic placement
◆Adjustment of mounting machine
Precautions
Technical
considerations
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
◆Wave soldering
1. Please refer to the specifications in the catalog for a wave soldering.
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, etc. sufficiently.
Precautions
◆Preheating when soldering
Heating : The temperature difference between soldering and remaining heat should not be greater than 150℃.
Cooling : The temperature difference between the components and cleaning process should not be greater than 100℃.
◆Recommended conditions for using a soldering iron
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350℃
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
◆Wave, Reflow, Lead free soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
【Recommended reflow condition】
Technical
considerations
◆Preheating when soldering
1. There is a case that products get damaged by a heat shock.
◆Recommended conditions for using a soldering iron
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipbeads_prec_e-E02R01
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